DocumentCode
119044
Title
Experimental and modeling study of high-viscosity silicone jet dispensing process for LED packaging
Author
Yun Chen ; Fuliang Wang ; Hanxiong Li ; Xiuyang Shan
Author_Institution
Sch. of Mech. & Electr. Eng., Central South Univ., Changsha, China
fYear
2014
fDate
12-15 Aug. 2014
Firstpage
1431
Lastpage
1436
Abstract
Silicone jet dispensing is the next generation dispensing method for LED packaging. However, as the jet dispensing is a high speed but micro dimensional transient process, the jet dispensing process is difficult to observe and measure, which brings many difficulties in dispenser designing and parameters optimization. This paper experimental studied the silicone jet dispensing process using a high-speed camera and numerically modeled it. The experiment demonstrates that 1) silicone jet dispensing process can be divided into five stages: jetted out, bridging, thinning, breaks up and recoils; 2) hundreds of milliseconds are needed for a whole dispensing process with high viscosity silicone; 3) several tenths of the energy stored in the spring is consumed by the friction. Reducing the friction, such as coating the needle, may be helpful for high viscosity silicone dispensing. The numerical model is verified by the experiment, and needle motions, forces on the needle, pressure at nozzle tip, and silicone jetting velocity during jet dispensing process are investigated. Simulation demonstrates that the needle motion can be divided into three stages: moving stage, oscillating stage and stop stage. The needle oscillation may the reason for causing satellite droplets. This study may provide useful insights for dispenser designing and optimization.
Keywords
electronics packaging; light emitting diodes; silicones; viscosity; LED packaging; breaks up stage; bridging stage; dispenser designing; friction reduction; high-speed camera; high-viscosity silicone jet dispensing process; jetted out stage; microdimensional transient process; needle coating; needle force; needle motion; needle oscillation; next generation dispensing method; nozzle tip pressure; parameter optimization; recoil stage; satellite droplet; silicone jetting velocity; thinning stage; LED packaging; Silicone jet dispensing; high-speed camera; needle motion; numerical model;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location
Chengdu
Type
conf
DOI
10.1109/ICEPT.2014.6922924
Filename
6922924
Link To Document