• DocumentCode
    1194109
  • Title

    Delay macromodels for point-to-point MCM interconnections

  • Author

    Kayssi, Ayman I. ; Sakallah, Karem A.

  • Author_Institution
    Dept. of Electr. Eng., American Univ. of Beirut, Lebanon
  • Volume
    17
  • Issue
    2
  • fYear
    1994
  • fDate
    5/1/1994 12:00:00 AM
  • Firstpage
    147
  • Lastpage
    152
  • Abstract
    We develop delay macromodels for lossless as well as lossy point-to-point MCM transmission lines using a systematic model construction procedure that includes dimensional analysis. The result for lossless lines confirms earlier work and extends it to the case of nonlinear drivers and capacitive termination. For lossy lines, we show that dimensional analysis allows us to reduce the complexity of the delay expression without any loss in accuracy. A second-order polynomial fit to a four-argument delay function is shown to yield predictions that are within 5% of detailed circuit simulation at a fraction of the computational cost. We illustrate the applications of these macromodels in studying the effects of packaging technology on signal delay and in sensitivity analysis
  • Keywords
    delays; equivalent circuits; modelling; multichip modules; sensitivity analysis; transmission line theory; MCM transmission lines; capacitive termination; delay macromodels; dimensional analysis; four-argument delay function; lossless lines; lossy lines; model construction procedure; multichip modules; nonlinear drivers; packaging technology; point-to-point MCM interconnections; second-order polynomial fit; sensitivity analysis; signal delay; Circuit simulation; Computational efficiency; Delay effects; Driver circuits; Integrated circuit interconnections; Packaging; Polynomials; Propagation losses; Sensitivity analysis; Transmission lines;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9894
  • Type

    jour

  • DOI
    10.1109/96.330436
  • Filename
    330436