Packaging Method for Increased Isolation Using a Microstrip to Waveguide Transition

Author

Schulwitz, Lora ; Ortiz, Sean ; Mortazawi, Amir

Author_Institution

Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI

Volume

17

Issue

3

fYear

2007

fDate

3/1/2007 12:00:00 AM

Firstpage

163

Lastpage

165

Abstract

A new technique to decrease crosstalk within high frequency packages, which is based on a microstrip to waveguide transition, is presented. The waveguide based packaged circuit demonstrates well over 40% bandwidth and the insertion loss throughout the designed frequency band is comparable to that of the conventional packaging approaches. In contrast to the conventional implementations, this new packaging method achieves approximately 20-dB isolation improvement for a test circuit as presented here. In addition, to suppress low frequency interference, a dc and low frequency filter is implemented as part of the waveguide transition

Keywords

electronics packaging; interference suppression; isolation technology; microwave filters; waveguide transitions; dc filter; electromagnetic interference; high frequency packages; interference suppression; isolation improvement; low frequency filter; microstrip to waveguide transition; packaging method; waveguide based packaged circuit; Bandwidth; Circuit testing; Crosstalk; Filters; Frequency; Insertion loss; Interference suppression; Microstrip; Packaging; Waveguide transitions; Crosstalk; electromagnetic interference (EMI); interconnect; packaging; waveguide transition;

fLanguage

English

Journal_Title

Microwave and Wireless Components Letters, IEEE

Publisher

ieee

ISSN

1531-1309

Type

jour

DOI

10.1109/LMWC.2006.890442

Filename

4118220