• DocumentCode
    1197012
  • Title

    Electromagnetic Considerations for Designing Double-Sided Power Modules

  • Author

    Mandray, Sylvain ; Guichon, Jean-Michel ; Schanen, Jean-Luc ; Guyennet, Michel Mermet ; Dienot, Jean-Marc

  • Author_Institution
    Grenoble Electr. Eng. Lab., St. Martin d´´Heres
  • Volume
    45
  • Issue
    2
  • fYear
    2009
  • Firstpage
    871
  • Lastpage
    879
  • Abstract
    Double-sided power modules are particularly attractive due to their high thermal performance. Thanks to the stacking of two direct bond coppers, very low stray inductances may be expected, particularly because of the proximity of the two rear metalizations. On the other hand, capacitive effects may be increased. In this paper, the complete electromagnetic behavior of double-sided power modules is studied, regarding both internal coupling and unwanted electromagnetic compatibility emissions. Some layout and active solutions are proposed to reduce common-mode emissions.
  • Keywords
    electromagnetic compatibility; hybrid integrated circuits; direct bond coppers; double-sided power modules; electromagnetic compatibility emissions; stray inductances; Bonding; Cooling; Electromagnetic compatibility; Electromagnetic coupling; Laboratories; Leg; Multichip modules; Power electronics; Power generation; Stacking; Electromagnetic compatibility; hybrid integrated circuit interconnections; hybrid integrated circuit packaging; power electronics; printed circuit layout;
  • fLanguage
    English
  • Journal_Title
    Industry Applications, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0093-9994
  • Type

    jour

  • DOI
    10.1109/TIA.2009.2013558
  • Filename
    4802260