• DocumentCode
    1197340
  • Title

    A test methodology for wafer scale system

  • Author

    Landis, David L.

  • Author_Institution
    Center for Microelectron. Res., Univ. of South Florida, Tampa, FL, USA
  • Volume
    11
  • Issue
    1
  • fYear
    1992
  • fDate
    1/1/1992 12:00:00 AM
  • Firstpage
    76
  • Lastpage
    82
  • Abstract
    To efficiently access and control on-chip design for test (DFT) circuitry, a standard test interface is required. A uniform testing interface is defined for each functional cell, with built-in self-test incorporated whenever possible. Use of a standard interface will reduce test complexity and costs by allowing entire wafer probing by a common standardized probe card, irrespective of the number of different functional cell types. Details are provided for the function, cell, and wafer level testing standards as well as for the procedures to be followed at wafer level restructuring and test. The test overhead area required is assessed; and for a large class of designs, the benefit of reduced input/output (I/O) area is found to more than compensate for the added test area
  • Keywords
    VLSI; automatic testing; built-in self test; digital integrated circuits; integrated circuit testing; WSI; built-in self-test; standard test interface; standardized probe card; test methodology; test overhead area; wafer probing; wafer scale system; Automatic testing; Built-in self-test; Circuit testing; Costs; Design for testability; Integrated circuit interconnections; Microelectronics; Probes; System testing; Wafer scale integration;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/43.108620
  • Filename
    108620