• DocumentCode
    1197701
  • Title

    Foreword Special Section on Drop Testing

  • Author

    Nguyen, Le T.

  • Volume
    30
  • Issue
    1
  • fYear
    2007
  • Firstpage
    41
  • Lastpage
    41
  • Abstract
    The six papers in this special section focus on drop testing. The papers are briefly summarized here.
  • Keywords
    Assembly; Cellular phones; Electronic equipment testing; Electronics packaging; Employee welfare; Industrial training; Semiconductor device modeling; Semiconductor device packaging; Thermal management; Wafer scale integration;
  • fLanguage
    English
  • Journal_Title
    Electronics Packaging Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-334X
  • Type

    jour

  • DOI
    10.1109/TEPM.2007.893269
  • Filename
    4118346
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1197701