• DocumentCode
    1197787
  • Title

    Theory of Tin Whisker Growth: “The End Game”

  • Author

    Smetana, Joe

  • Author_Institution
    Adv. Technol., Plano, TX
  • Volume
    30
  • Issue
    1
  • fYear
    2007
  • Firstpage
    11
  • Lastpage
    22
  • Abstract
    Previous theories of the tin whisker growth proposing various dislocation mechanisms have been largely disproved. This paper presents a new and different theory for the mechanism of tin whisker growth. The theory addresses the fundamental requirements for Sn to diffuse to the base of the whisker grain and proposes a mechanism for whisker initiation and growth. Part of this is a theoretical proposal as to what makes the whisker grain different. The role of oxidation in whisker growth is also briefly addressed. Using this theory, attempts are made to illustrate how different whisker shapes are created. Finally, a proposed potential solution to tin whisker growth is presented, assuming that this theory is correct
  • Keywords
    tin; whiskers (crystal); Sn; tin whisker growth; whisker growth oxidation; Atomic layer deposition; Contact resistance; Electronics industry; Fasteners; Game theory; Industrial electronics; Oxidation; Proposals; Shape memory alloys; Tin alloys; Lead free; Sn whiskers; reliability; tin; tin alloys;
  • fLanguage
    English
  • Journal_Title
    Electronics Packaging Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-334X
  • Type

    jour

  • DOI
    10.1109/TEPM.2006.890645
  • Filename
    4118365