DocumentCode
1197787
Title
Theory of Tin Whisker Growth: “The End Game”
Author
Smetana, Joe
Author_Institution
Adv. Technol., Plano, TX
Volume
30
Issue
1
fYear
2007
Firstpage
11
Lastpage
22
Abstract
Previous theories of the tin whisker growth proposing various dislocation mechanisms have been largely disproved. This paper presents a new and different theory for the mechanism of tin whisker growth. The theory addresses the fundamental requirements for Sn to diffuse to the base of the whisker grain and proposes a mechanism for whisker initiation and growth. Part of this is a theoretical proposal as to what makes the whisker grain different. The role of oxidation in whisker growth is also briefly addressed. Using this theory, attempts are made to illustrate how different whisker shapes are created. Finally, a proposed potential solution to tin whisker growth is presented, assuming that this theory is correct
Keywords
tin; whiskers (crystal); Sn; tin whisker growth; whisker growth oxidation; Atomic layer deposition; Contact resistance; Electronics industry; Fasteners; Game theory; Industrial electronics; Oxidation; Proposals; Shape memory alloys; Tin alloys; Lead free; Sn whiskers; reliability; tin; tin alloys;
fLanguage
English
Journal_Title
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
1521-334X
Type
jour
DOI
10.1109/TEPM.2006.890645
Filename
4118365
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