Interdiffusion and grain isolation in Co/Cr thin films

Author

Feng, Y.C. ; Laughlin, D.E. ; Lambeth, D.N.

Author_Institution

Data Storage Syst. Center, Carnegie Mellon Univ., Pittsburgh, PA, USA

Volume

Issue

fYear

1994

fDate

11/1/1994 12:00:00 AM

Firstpage

3948

Lastpage

3950

Abstract

In this work, interdiffusion and grain isolation in Co/Cr films have been investigated by studying the dependence of the magnetic properties on the substrate preheating temperature as well as on post-deposition annealing processes. By choosing pure Co instead of a Co-alloy, the possibility of grain isolation caused by the segregation of solute atoms from within the magnetic layer has been eliminated. It is found that both post-deposition thermal annealing and substrate preheating can effectively increase the isolation of the Co grains

Keywords

annealing; chemical interdiffusion; chromium; cobalt; coercive force; ferromagnetic materials; grain boundary diffusion; magnetic multilayers; Co/Cr thin films; Cr-Co-Cr; grain isolation; interdiffusion; magnetic properties; post-deposition annealing processes; substrate preheating temperature; thermal annealing; Annealing; Atomic layer deposition; Chromium; Coercive force; Grain boundaries; Magnetic films; Magnetic properties; Magnetic separation; Temperature; Transistors;

fLanguage

English

Journal_Title

Magnetics, IEEE Transactions on

Publisher

ieee

ISSN

0018-9464

Type

jour

DOI

10.1109/20.333953

Filename

333953

Link To Document

https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1198456