New hybrid integrated laser diode-drivers using microsolder bump bonding: SPICE simulation of high-speed modulation characteristics

Author

Hayashi, Tsuyoshi ; Katsura, Kohsuke ; Tsunetsugu, Hideki

Author_Institution

Interdisciplinary Res. Lab., NTT, Tokyo, Japan

Volume

12

Issue

11

fYear

1994

fDate

11/1/1994 12:00:00 AM

Firstpage

1963

Lastpage

1970

Abstract

This paper proposes two types of new hybrid integrated laser diode (LD)-drivers that use microsolder bump bonding instead of conventional wire bonding. In one, an LD and a driver are flip-chip bonded to each other; in the other, an LD and a driver are flip-chip bonded onto a substrate. Their performances are compared to those of a monolithic LD-driver and a conventional hybrid one using wire bonding by a simulation program with integrated circuit emphasis (SPICE) with particular emphasis on high-speed LD modulation. The nonreturn-to-zero (NRZ) eye patterns modulated at signal speeds up to 30 Gb/s by the new hybrid integrated LD-drivers were hardly inferior to those by the monolithic LD-driver, whereas those by conventional hybrid ones were greatly degraded over 10 Gb/s. The new hybrid integrated LD-drivers are a feasible alternative to monolithic ones for high-speed optical transmitters

Keywords

SPICE; flip-chip devices; hybrid integrated circuits; hybrid simulation; integrated optoelectronics; lead bonding; optical modulation; optical transmitters; semiconductor lasers; soldering; 10 Gbit/s; 30 Gbit/s; LD; SPICE simulation; flip-chip bonded; high-speed LD modulation; high-speed modulation characteristics; high-speed optical transmitters; hybrid integrated LD-drivers; hybrid integrated laser diode-drivers; microsolder bump bonding; nonreturn-to-zero eye patterns; signal speeds; substrate; Bonding; Diodes; Driver circuits; High speed optical techniques; Integrated optics; Optical devices; Optical modulation; Optical transmitters; SPICE; Wire;

fLanguage

English

Journal_Title

Lightwave Technology, Journal of

Publisher

ieee

ISSN

0733-8724

Type

jour

DOI

10.1109/50.336061

Filename

336061