Demountable TAB-a new path for TAB technology

Author

Pendse, Rajendra D. ; Afshari, Bahram ; Heflinger, Bruce ; Matta, Farid ; Rastogi, Vivek

Author_Institution

Hewlett-Packard Co., Palo Alto, CA, USA

Volume

17

Issue

4

fYear

1994

fDate

11/1/1994 12:00:00 AM

Firstpage

527

Lastpage

536

Abstract

Despite its advantages, the proliferation of TAB technology in the high lead count single chip packaging world has been somewhat limited by factors such as high entry cost and complex board-level assembly methods. In the area of MCM´s, the difficulty of rework/repair of TAB emerges as a serious limiter. The TAB package developed at Hewlett-Packard addresses these very issues by providing bumpless inner lead bonding and demountable outer lead connection (hence called Demountable TAB, or DTAB). In the present paper, a comprehensive compilation of the DTAB packaging scheme is presented. The package construction, assembly procedure, PC board design considerations, thermal performance, electrical characterization and reliability testing are presented in detail

Keywords

integrated circuit packaging; integrated circuit reliability; lead bonding; multichip modules; printed circuit design; tape automated bonding; DTAB packaging scheme; MCMs; PC board design considerations; TAB technology; assembly procedure; bumpless inner lead bonding; demountable TAB; demountable outer lead connection; electrical characterization; lead count; package construction; reliability testing; repair; rework; single chip packaging; thermal performance; Application software; Assembly; Bonding; Costs; Electronic packaging thermal management; Electronics packaging; Lead; Manufacturing; Testing; Wire;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.338719

Filename

338719