DocumentCode
1214268
Title
PCM thermal control unit for portable electronic devices: experimental and numerical studies
Author
Alawadhi, Esam M. ; Amon, Cristina H.
Author_Institution
Dept. of Mech. Eng., Kuwait Univ., Safat, Kuwait
Volume
26
Issue
1
fYear
2003
fDate
3/1/2003 12:00:00 AM
Firstpage
116
Lastpage
125
Abstract
This paper investigates the effectiveness of a thermal control unit (TCU) for portable electronic devices by performing experimental and numerical analyses. The TCU objective is to improve thermal management of electronic devices when their operating time is limited to a few hours. It is composed of an organic phase change material (PCM) and a thermal conductivity enhancer (TCE). To overcome the relatively low thermal conductivity of the PCM, a TCE is incorporated into the PCM to boost its conductivity. The TCU structure is complex, and modeling an electronic device with it requires time and effort. Hence, this research develops approximate, yet effective, solutions for modeling the TCU, which employ effective thermo-physical properties. The TCU component properties are averaged and a single TCU material is considered. This approach is evaluated by comparing the numerical predictions with the experimental results. The numerical model is then used to study the effect of important parameters that are experimentally expensive to examine, such as the PCM latent heat, Stefan number, and heat source power. It is shown that the TCU can provide a reliable solution to portable electronic devices, which avoids overheating and thermally-induced fatigue, as well as a solution which satisfies the ergonomic requirement.
Keywords
numerical analysis; phase transformations; thermal analysis; thermal conductivity; thermal management (packaging); thermal variables control; PCM thermal control unit; Stefan number; heat source power; latent heat; modeling; numerical model; numerical predictions; organic phase change material; portable electronic devices; thermal conductivity enhancer; thermal management; thermo-physical properties; Conducting materials; Electronic components; Electronics cooling; Heat transfer; Mechanical engineering; Phase change materials; Temperature; Thermal conductivity; Thermal management; Thermal management of electronics;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2003.811480
Filename
1202910
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