• DocumentCode
    121443
  • Title

    The importance of Se partial pressure in the laser annealing of CuInSe2 electrodeposited precursors

  • Author

    Meadows, Helene J. ; Regesch, David ; Schuler, Thomas ; Misra, Sudip ; Simonds, Brian J. ; Scarpulla, Michael A. ; Gerliz, Viktor ; Gutay, Levent ; Dale, Phillip

  • Author_Institution
    Lab. for Energy Mater., Univ. of Luxembourg, Belvaux, Luxembourg
  • fYear
    2014
  • fDate
    8-13 June 2014
  • Abstract
    One method for producing CuInSe2 (CISe) absorber layers is electrodeposition followed by annealing. Replacing the commonly used furnace annealing step with a laser can reduce annealing times by 2-3 orders of magnitude: from 30 minutes to 1 s. However, laser processing has, to date, not resulted in absorber layers which can form functioning final devices. One reason is due to Se loss during annealing even on these short timescales. We show how this Se loss is reduced by using a background partial pressure of Se (PSe) during annealing. Higher PSe results in increased grain size and drastically increased photoluminescence yield. The introduction of an elevated PSe in the laser annealing chamber enabled the fabrication of the first known CuInSe2 photovoltaic device using electrodeposition followed by laser annealing which gave 1.6% efficiency.
  • Keywords
    copper compounds; electrodeposition; grain size; indium compounds; laser beam annealing; photoluminescence; semiconductor growth; ternary semiconductors; absorber layers; electrodeposited precursors; furnace annealing step; grain size; laser annealing chamber; laser processing; partial pressure; photoluminescence yield; photovoltaic device; Annealing; Materials; Measurement by laser beam; Photovoltaic systems; Semiconductor device measurement; Semiconductor lasers; X-ray diffraction; annealing; lasers; photovoltaic systems; thin films;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialist Conference (PVSC), 2014 IEEE 40th
  • Conference_Location
    Denver, CO
  • Type

    conf

  • DOI
    10.1109/PVSC.2014.6924944
  • Filename
    6924944