• DocumentCode
    1214496
  • Title

    Finite element analysis extends its domain

  • Author

    Rodamaker, Mark C.

  • Author_Institution
    MCR Associates, USA
  • Volume
    11
  • Issue
    1
  • fYear
    1995
  • fDate
    1/1/1995 12:00:00 AM
  • Firstpage
    22
  • Lastpage
    27
  • Abstract
    Finite element analysis (FEA), traditionally used to predict stress and dynamic response in mechanical systems, is finding its way into a wider realm of electrical engineering applications. These tasks range from finding the temperature distribution in IC packages, to analyzing mechanical and electrical faults in disk drives. This article addresses the capabilities of such programs to solve critical engineering problems by presenting an overview of current and potential uses for FEA in electrical engineering
  • Keywords
    electrical engineering; electrical engineering computing; finite element analysis; FEA; critical engineering problems; electrical engineering applications; electrical faults; finite element analysis; mechanical faults; temperature distribution; Computer networks; Disk drives; Electrical engineering; Finite element methods; Integrated circuit interconnections; Integrated circuit packaging; Resistors; Stress; Temperature distribution; Transmission line matrix methods;
  • fLanguage
    English
  • Journal_Title
    Circuits and Devices Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    8755-3996
  • Type

    jour

  • DOI
    10.1109/101.340309
  • Filename
    340309
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1214496