• DocumentCode
    1215608
  • Title

    Tunable work function in fully nickel-silicided polysilicon gates for metal gate MOSFET applications

  • Author

    Yuan, Jun ; Woo, Jason C S

  • Author_Institution
    Dept. of Electr. Eng., Univ. of California, Los Angeles, CA, USA
  • Volume
    26
  • Issue
    2
  • fYear
    2005
  • Firstpage
    87
  • Lastpage
    89
  • Abstract
    The work function of fully nickel-silicided polysilicon was investigated. The midgap work function (4.7 eV) was obtained for undoped mononickel-silicide (NiSi). It was shown that the implantation of both arsenic and antimony into the polysilicon before silicidation reduces the NiSi work function, and the change in work function is greater for antimony than for arsenic. The pile-up of these species at the oxide interface during the nickel silicidation is demonstrated to be the physical mechanism responsible for the work function shift. Both species activations before silicidation and silicidation conditions were found to affect the NiSi work function shift significantly. The nonactivated species have minimum effect and incomplete silicidation can have maximum work function shift. The doping effect of indium on the NiSi work function is reported for the first time. A shift of ∼0.14 eV toward the valence band was obtained for 2.6-nm oxide capacitors. It was found that the work function shift caused by the indium doping is saturated at a relatively low dose, which may be related to the low solid solubility of indium in polysilicon.
  • Keywords
    MOSFET; antimony; arsenic; indium; nickel compounds; semiconductor doping; valence bands; work function; 2.6 nm; 4.7 eV; NiSi:As; NiSi:In; NiSi:Sb; antimony implantation; arsenic implantation; doping effect; fully nickel-silicided polysilicon gates; indium doping; metal gate MOSFET application; nickel silicidation; oxide capacitors; oxide interface; tunable work function; undoped mononickel-silicide; valence band; work function shift; Capacitors; Doping; Indium; MOS devices; MOSFET circuits; Nickel; Rapid thermal annealing; Silicidation; Silicides; Voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2004.841439
  • Filename
    1386403