• DocumentCode
    121855
  • Title

    Challenges in deposition of wide band gap copper indium aluminum gallium selenide (CIAGS) thin films for tandem solar cells

  • Author

    Karthikeyan, S. ; Sibakoti, Mandip ; Liptak, Richard ; Sang Ho Song ; Abrahamson, Jenny ; Aydil, Eray S. ; Campbell, Stephen A.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Minnesota, Minneapolis, MN, USA
  • fYear
    2014
  • fDate
    8-13 June 2014
  • Firstpage
    1632
  • Lastpage
    1634
  • Abstract
    Copper indium gallium diselenide (CIGS) based solar cells have shown efficiencies > 20% on the lab scale and are already in commercial production. Even though the optimal band gap of 1.6eV to 1.7eV can be achieved by increasing the Ga content, these solar cells show a maximum efficiency at ~1.3eV and any further increase in the Ga concentration and band gap results in lower efficiencies due to bulk and interfacial traps. This also prevents the use of wide band gap CIGS layer as a top cell for harvesting the solar cell spectrum in a tandem cell configuration. This paper reports the manufacturing challenges on the production of wide band gap aluminum doped CIGS layers (CIAGS) and devices fabricated using this material. We have fabricated 11.3% efficient solar cells using the CIAGS absorber layers.
  • Keywords
    aluminium compounds; copper compounds; energy gap; gallium compounds; indium compounds; semiconductor thin films; solar cells; ternary semiconductors; vacuum deposition; wide band gap semiconductors; CIAGS; CuInAlGaSe; absorber layers; bulk traps; copper indium aluminum gallium selenide thin films; interfacial traps; optimal band gap; solar cell spectrum; tandem cell configuration; wide band gap aluminum doped CIGS layers; Gallium; Indium; Photonic band gap; Photovoltaic cells; Physics; Production; Spectroscopy; CIAGS solar cells; tandem solar cells; wide band gap absorber layer;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialist Conference (PVSC), 2014 IEEE 40th
  • Conference_Location
    Denver, CO
  • Type

    conf

  • DOI
    10.1109/PVSC.2014.6925232
  • Filename
    6925232