• DocumentCode
    1219988
  • Title

    Finite element contact analysis on a horn-holder assembly for wire bonding

  • Author

    Jang, Changsoo ; Ahn, Geun Sik ; Kim, Yung Joon ; Kwak, Dong Ok ; Booh, SeongWoon ; Kim, Jae Ok

  • Author_Institution
    Precision Instrum. R&D Center, Samsung Techwin Co. Ltd., Sungnam, South Korea
  • Volume
    26
  • Issue
    1
  • fYear
    2003
  • Firstpage
    46
  • Lastpage
    53
  • Abstract
    The joint structure of a transducer horn-holder assembly for a wire bonder was examined through finite element contact analysis. Three-dimensional modeling and analysis was carried out to survey the internal physics of this structure and to verify the accuracy of a proposed computation relative to measurement. After validation, a two-dimensional model was built to conduct parametric studies and improve the efficiency and speed of the computation. Several factors such as boundary conditions, modeling boundary, and mesh density, were considered to obtain consistency with the three-dimensional analysis. Arc angle and the position of each holder boss were chosen as design parameters. A designed computation approach was applied for efficiency in computation. As a result, a guideline for holder boss design was suggested, and the main factors and their influence on stress concentration in the transducer horn were surveyed.
  • Keywords
    finite element analysis; lead bonding; modelling; stress analysis; ultrasonic bonding; ultrasonic transducers; 2D model; 3D analysis; 3D modeling; US transducer horn; arc angle; boundary conditions; design parameters; finite element contact analysis; holder boss position; mesh density; modeling boundary; stress concentration; three-dimensional modeling; transducer horn-holder assembly; two-dimensional model; wire bonder; Assembly; Bonding; Boundary conditions; Finite element methods; Guidelines; Parametric study; Physics computing; Stress; Transducers; Wire;
  • fLanguage
    English
  • Journal_Title
    Electronics Packaging Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-334X
  • Type

    jour

  • DOI
    10.1109/TEPM.2003.812999
  • Filename
    1205222