• DocumentCode
    1221562
  • Title

    On proximity exposure compensation in electron-beam lithography

  • Author

    Deshmukh, P.R. ; Khokle, W.S.

  • Author_Institution
    Central Electron. Eng. Res. Inst., Pilani, India
  • Volume
    36
  • Issue
    9
  • fYear
    1989
  • fDate
    9/1/1989 12:00:00 AM
  • Firstpage
    2011
  • Lastpage
    2017
  • Abstract
    The limit of proximity exposure compensation in electron-beam lithography by a dose-correlation technique is pointed out. It is shown that the electron energy dissipation (EED) distribution in the resist plays an important role in achieving this limiting condition. Simulation of resist profiles in isolated and closely spaced near-micrometer line patterns shows that the resist edge slope after proximity exposure compensation approaches a limiting slope set by the composite effect of the EED distribution, the beam size, the beam spacing, and the beam shape
  • Keywords
    compensation; electron beam lithography; beam shape; beam size; beam spacing; dose-correlation technique; electron energy dissipation distribution; electron-beam lithography; limiting condition; near-micrometer line patterns; proximity exposure compensation; resist edge slope; resist profiles; Composite materials; Computational modeling; Electrons; Energy dissipation; Lithography; Monte Carlo methods; Resists; Scattering; Shape; Substrates;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.34285
  • Filename
    34285