• DocumentCode
    122423
  • Title

    Impact of die-attach materials on MEMS gyro performance

  • Author

    Filipe, A. ; Vincent, M. ; Volant, V. ; Kergueris, C.

  • Author_Institution
    TRONICS Group, Crolles, France
  • fYear
    2014
  • fDate
    25-26 Feb. 2014
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    We have performed an experimental assessment of the impact of assembly materials on MEMS gyro thermal behavior. Very significant differences are obtained depending on the type and quantity of die-attach. The analysis gives insights on the proper selection of die-attach materials.
  • Keywords
    gyroscopes; microassembling; microsensors; temperature sensors; MEMS gyrothermal behavior; die-attach material assembly; Ceramics; Integrated circuits; Micromechanical devices; Packaging; Silicon; Stress; MEMS; die-attach; gyro; materials; packaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Inertial Sensors and Systems (ISISS), 2014 International Symposium on
  • Conference_Location
    Laguna Beach, CA
  • Type

    conf

  • DOI
    10.1109/ISISS.2014.6782530
  • Filename
    6782530
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=122423