Experiments of device failures in a spatial power-combining array

Author

Lin, Jenshan ; Itoh, Tatsuo

Author_Institution

Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA

Volume

43

Issue

2

fYear

1995

fDate

2/1/1995 12:00:00 AM

Firstpage

267

Lastpage

271

Abstract

The performance of a spatial power-combining array with device failure is investigated. Experimental results show that the array still combines the power in the broadside direction when the DC open-circuit failure occurs. Analysis of measured radiation patterns indicated that the power radiated from the patch antenna attached to the failed device is much smaller than the power radiated from other patch antennas. The effects of the chip resistor and the RF impedance of failed device are discussed

Keywords

MMIC; active antenna arrays; antenna radiation patterns; microstrip antenna arrays; microstrip circuits; power combiners; DC open-circuit failure; RF impedance; active antenna; broadside direction; chip resistor; device failures; microstrip circuit; patch antenna; quasi-optical oscillators; radiation patterns; spatial power-combining array; Antenna measurements; Antenna radiation patterns; Failure analysis; Impedance; Patch antennas; Pattern analysis; Power measurement; Radio frequency; Resistors; Semiconductor device measurement;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/22.348083

Filename

348083