A technique for interconnecting millimeter wave integrated circuits using BCB and bump bonds

Author

Carrillo-Ramirez, Rodrigo ; Jackson, Robert W.

Author_Institution

Dept. of Electr. & Comput. Eng., Univ. of Massachusetts, Amherst, MA, USA

Volume

13

Issue

6

fYear

2003

fDate

6/1/2003 12:00:00 AM

Firstpage

196

Lastpage

198

Abstract

A low cost interconnection scheme for millimeter wave modules is presented. This technique allows the integration of hybrid components using an inexpensive micromachined silicon motherboard and benzocyclobutene (BCB) films. The excellent planarity of BCB allows vias to be formed using bumps fabricated prior to BCB application. This approach eliminates the need for laser drilling, plasma etching, and plated holes. Several representative GaAs pHEMT´s were packaged using this technique. Measurements show minimal performance degradation from 1 GHz to 48 GHz.

Keywords

MIMIC; integrated circuit bonding; integrated circuit interconnections; integrated circuit packaging; micromachining; multichip modules; 1 to 48 GHz; BCB film; GaAs; GaAs pHEMT; MCM packaging technology; Si; bump bond; hybrid component; interconnection technique; micromachined silicon motherboard; millimeter-wave integrated circuit; Costs; Drilling; Integrated circuit interconnections; Millimeter wave integrated circuits; Millimeter wave technology; Plasma applications; Plasma measurements; Plasma waves; Semiconductor films; Silicon;

fLanguage

English

Journal_Title

Microwave and Wireless Components Letters, IEEE

Publisher

ieee

ISSN

1531-1309

Type

jour

DOI

10.1109/LMWC.2003.811677

Filename

1208405