• DocumentCode
    1228912
  • Title

    Experimental verification of a novel electrical test structure for measuring contact size

  • Author

    Freeman, G. ; Lukaszek, W. ; Ekstedt, T.W. ; Peters, D.W.

  • Author_Institution
    Center for Integrated Syst., Stanford Univ., CA, USA
  • Volume
    2
  • Issue
    1
  • fYear
    1989
  • Firstpage
    9
  • Lastpage
    15
  • Abstract
    An electrical test structure that measures contact size without reliance on contact resistivity measurements is presented. A comparison with SEM photographs shows that the structure measures contact size in the range of 1.0 mu m with a resolution close to 0.2 mu m. Results are shown for measuring the size of contacts to poly, but the concept should also apply to measuring contacts to active areas, or contacts between two metal layers. In addition to the size of contacts to poly, the structure presented also measures the linewidth and sheet resistance of the poly, and misalignment of contacts to poly. It consists of a digital vernier of 72 samples and a linewidth structure and is implemented without active circuitry in a 2 by 12 pad array using three masking levels.<>
  • Keywords
    metallisation; semiconductor device testing; semiconductor technology; spatial variables measurement; 1 micron; contact misalignment; contact size measurement; digital vernier; electrical test structure; linewidth; sheet resistance; submicron resolution; Conductivity; Contact resistance; Control equipment; Electric variables measurement; Electrical resistance measurement; Monitoring; Scanning electron microscopy; Size measurement; Strips; Testing;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/66.16998
  • Filename
    16998