DocumentCode
1228912
Title
Experimental verification of a novel electrical test structure for measuring contact size
Author
Freeman, G. ; Lukaszek, W. ; Ekstedt, T.W. ; Peters, D.W.
Author_Institution
Center for Integrated Syst., Stanford Univ., CA, USA
Volume
2
Issue
1
fYear
1989
Firstpage
9
Lastpage
15
Abstract
An electrical test structure that measures contact size without reliance on contact resistivity measurements is presented. A comparison with SEM photographs shows that the structure measures contact size in the range of 1.0 mu m with a resolution close to 0.2 mu m. Results are shown for measuring the size of contacts to poly, but the concept should also apply to measuring contacts to active areas, or contacts between two metal layers. In addition to the size of contacts to poly, the structure presented also measures the linewidth and sheet resistance of the poly, and misalignment of contacts to poly. It consists of a digital vernier of 72 samples and a linewidth structure and is implemented without active circuitry in a 2 by 12 pad array using three masking levels.<>
Keywords
metallisation; semiconductor device testing; semiconductor technology; spatial variables measurement; 1 micron; contact misalignment; contact size measurement; digital vernier; electrical test structure; linewidth; sheet resistance; submicron resolution; Conductivity; Contact resistance; Control equipment; Electric variables measurement; Electrical resistance measurement; Monitoring; Scanning electron microscopy; Size measurement; Strips; Testing;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/66.16998
Filename
16998
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