• DocumentCode
    1229004
  • Title

    Rinse strategy [PC board manufacture]

  • Author

    McBride, Donald G.

  • Author_Institution
    Sci. & Technol. Associates, Binghamton, NY, USA
  • Volume
    12
  • Issue
    1
  • fYear
    1996
  • fDate
    1/1/1996 12:00:00 AM
  • Firstpage
    20
  • Lastpage
    22
  • Abstract
    The rinse strategy has been conceived and tested in aqueous and gaseous environments. There are significant environmental benefits: water usage and waste stream reduction are optimized. Chemical volume is reduced. There are process uniformity and control improvements. The number of process steps is reduced, and there have been enhancements to the process rate. Yield is enhanced and costs are reduced. Smaller expenditures are required to achieve spectacular results. Current equipment can be retrofitted at a small cost. New equipment can be designed and built at a fraction of the cost of standard off-the-shelf equipment for any wet or dry process
  • Keywords
    environmental factors; planning; printed circuit manufacture; surface cleaning; PC board manufacture; aqueous environments; chemical volume; dry process; environmental benefits; gaseous environments; process rate; process uniformity; rinse strategy; waste stream reduction; water usage; wet process; Chemical processes; Cleaning; Conductivity; Engineering profession; Etching; Floods; Manufacturing processes; Monitoring; Project management; Resins;
  • fLanguage
    English
  • Journal_Title
    Circuits and Devices Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    8755-3996
  • Type

    jour

  • DOI
    10.1109/101.481205
  • Filename
    481205