• DocumentCode
    123140
  • Title

    Degradation analysis of datapath logic subblocks under NBTI aging in FinFET technology

  • Author

    Kukner, Halil ; Khatib, Mutamed ; Morrison, Sebastien ; Weckx, Pieter ; Raghavan, Praveen ; Kaczer, Ben ; Catthoor, Francky ; Van der Perre, Liesbet ; Lauwereins, Rudy ; Groeseneken, Guido

  • Author_Institution
    imec vzw., Leuven, Belgium
  • fYear
    2014
  • fDate
    3-5 March 2014
  • Firstpage
    473
  • Lastpage
    479
  • Abstract
    Reliability of advanced deeply scaled CMOS technologies is being threatened by time-dependent degradation mechanisms such as Negative Bias Temperature Instability (NBTI) phenomenon that cause workload-dependent shifts on a transistor´s threshold voltage (Vth), and performance during its lifetime. In this study, NBTI related performance degradation of datapath logic subblocks (i.e. adder, multiplier, shifter, mux-demux) are investigated in relation to workload dependency, and architectural topology at 10nm FinFET technology. A workload-dependent, NBTI aging-aware digital design flow was developed within the industry standard EDA tool chain. NBTI model is based on the measured Capture and Emission Time (CET) maps, and scaled to 10nm node. Static Timing Analysis (STA) is performed to evaluate the performance degradation at 3σ corner. Results on datapath subblocks under NBTI aging after 3 years show a performance loss up to 16.7%. NBTI aging results in the replacement of the time-zero critical path by a non-critical path during a circuit´s lifetime, and it can be significantly high as 91%. Finally, the correlation between aging sensitivity to workload variations, and architectural parameters are shown, and it can vary 12×, and 9×, respectively.
  • Keywords
    MOSFET; ageing; logic circuits; performance evaluation; semiconductor device reliability; CET map; FinFET technology; NBTI aging-aware digital design flow; STA; adder; advanced deeply scaled CMOS technology; capture and emission time map; datapath logic subblock analysis; industry standard EDA tool chain; multiplier; mux-demux; negative bias temperature instability phenomenon; reliability; shifter; size 10 nm; static timing analysis; time 3 year; time-dependent degradation mechanism; time-zero critical path; transistor threshold voltage; Adders; Aging; Computer architecture; Degradation; Delays; Microprocessors; Bias Temperature Instability; FinFET; aging; datapath; library characterization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design (ISQED), 2014 15th International Symposium on
  • Conference_Location
    Santa Clara, CA
  • Print_ISBN
    978-1-4799-3945-9
  • Type

    conf

  • DOI
    10.1109/ISQED.2014.6783362
  • Filename
    6783362