• DocumentCode
    1231723
  • Title

    Large-Area Well-Ordered Nanodot Array Pattern Fabricated With Self-Assembled Nanosphere Template

  • Author

    Li, Huaqing ; Low, Jeremy ; Brown, Kolin S. ; Wu, Nianqiang

  • Author_Institution
    Dept. of Mech. & Aerosp. Eng., West Virginia Univ., Morgantown, WV
  • Volume
    8
  • Issue
    6
  • fYear
    2008
  • fDate
    6/1/2008 12:00:00 AM
  • Firstpage
    880
  • Lastpage
    884
  • Abstract
    This paper has demonstrated a simple method to fabricate a large-area (~1 cm2) well-ordered gold nanodot array pattern with high throughput at low cost. At first, self-assembled polystyrene (PS) spheres are closely packed on a water surface, and then transferred from the water surface to a solid substrate by dip coating. This results in a large-area defect-free close-packed PS sphere monolayer template on the solid substrate. It is worthy noting that the large-area close-packed PS sphere template can be transferred to the surfaces of various solids including silicon, oxides and metals, offering great flexibility. Furthermore, the close-packed PS monolayer can be tailored to a loose-packed sphere array template by reactive ion etching (RIE) technique. The sphere size is reduced upon etching but the spacing between spheres retains unchanged. By utilizing the PS sphere template, gold nanodot arrays with feature size down to 30 nm have been fabricated.
  • Keywords
    gold; monolayers; nanostructured materials; organic compounds; self-assembly; sputter etching; Au; dip coating; metals; monolayer; nanofabrication; oxides; reactive ion etching technique; self-assembled polystyrene spheres; silicon; well-ordered gold nanodot array pattern; Costs; Etching; Gold; Lithography; Nanofabrication; Nanostructures; Self-assembly; Silicon; Solids; Throughput; Array; nanofabrication; nanoscale pattern; nanosphere lithography; patterning;
  • fLanguage
    English
  • Journal_Title
    Sensors Journal, IEEE
  • Publisher
    ieee
  • ISSN
    1530-437X
  • Type

    jour

  • DOI
    10.1109/JSEN.2008.923266
  • Filename
    4529188