• DocumentCode
    1233610
  • Title

    Analysis of CMOS Photodiodes. II. Lateral photoresponse

  • Author

    Lee, Ji Soo ; Hornsey, Richard I. ; Renshaw, David

  • Author_Institution
    Univ. of Waterloo, Ont., Canada
  • Volume
    50
  • Issue
    5
  • fYear
    2003
  • fDate
    5/1/2003 12:00:00 AM
  • Firstpage
    1239
  • Lastpage
    1245
  • Abstract
    For pt.I see ibid., vol.50, no.5, p.1233-38 (2003). In Part I of this paper, an improved one-dimensional (1-D) analysis and a semiempirical model of quantum efficiency for CMOS photodiode was illustrated. In this part of the paper, the lateral photoresponse in CMOS photodiode arrays is investigated with test linear photodiode arrays and numerical device simulations. It is shown that the surface recombination and mobility degradation along the Si-SiO2 interface are important factors in determining the lateral photoresponse of CMOS photodiodes. The limitations of traditional analytical approaches are briefly discussed in this context, and a novel three-dimensional (3-D) analysis of lateral photoresponse is presented. Given the significant dependence of lateral photoresponse on the Si-SiO2 interface quality, an empirical characterization method is proposed as a more reliable solution to modeling lateral photoresponse.
  • Keywords
    CMOS image sensors; arrays; carrier mobility; photodiodes; semiconductor device models; semiconductor-insulator boundaries; surface recombination; 3D analysis; APS; CMOS image sensor; CMOS photodiode; Si-SiO2; Si-SiO2 interface; active pixel sensor; edge-effect; empirical characterization method; lateral diffusion; lateral photoresponse; linear photodiode arrays; mobility degradation; numerical device simulations; quantum efficiency; surface recombination; three-dimensional analysis; CMOS image sensors; CMOS technology; Crosstalk; Degradation; Numerical simulation; Photodiodes; Pixel; Radiative recombination; Semiconductor device modeling; Sensor arrays;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2003.813233
  • Filename
    1210769