• DocumentCode
    1236167
  • Title

    Thermal annealing of Nb/Al-AlOx/Nb Josephson junctions

  • Author

    Migacz, Justin V. ; Huber, Martin E.

  • Author_Institution
    Cherry Creek High Sch., Denver, CO, USA
  • Volume
    13
  • Issue
    2
  • fYear
    2003
  • fDate
    6/1/2003 12:00:00 AM
  • Firstpage
    123
  • Lastpage
    126
  • Abstract
    We thermally annealed single un-shunted Josephson junctions at temperatures of 110 to 270°C for durations of 2.5 to 90 minutes. We also exposed some junctions for three separate 15-minute periods in order to compare the result with that of a continuous 45-minute exposure. After annealing, we measured the changes in junction properties such as critical current IC, normal state resistance RN, and junction quality parameter VM. IC decreases with increased exposure, (starting at approximately 125°C) and RN increases, such that the ICRN product remains roughly constant up to 200°C, at which point ICRN also begins to decrease. VM declines slightly with increased exposure, but with a large amount of scatter. Samples with interrupted exposures degraded less than if annealed continuously. Based on our results, we find that junctions can tolerate an exposure of up to 90 minutes at temperatures as high as 200°C without significant degradation in performance, though allowances will need to be made for shifts in critical current. Junctions exposed for up to 15 minutes at 225°C are degraded further but may still function well enough for some applications.
  • Keywords
    Josephson effect; aluminium; aluminium compounds; annealing; niobium; 110 to 270 degC; Nb-Al-AlO-Nb; Nb/Al-AlOx/Nb Josephson junction; critical current; normal state resistance; quality parameter; thermal annealing; Annealing; Critical current; Current measurement; Electrical resistance measurement; Electrodes; Josephson junctions; Niobium; Ovens; Temperature measurement; Thermal degradation;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2003.813661
  • Filename
    1211557