DocumentCode
1246094
Title
Degradation of an X-Ku band GaAs/AlGaAs power HBT MMIC under RF stress
Author
Gupta, Aditya ; Ali, Fazal ; Dawson, Dale ; Smith, Paul
Author_Institution
Adv. Technol. Div., Westinghouse Electr. Corp., Baltimore, MD, USA
Volume
6
Issue
1
fYear
1996
fDate
1/1/1996 12:00:00 AM
Firstpage
43
Lastpage
45
Abstract
This paper summarizes the observed degradation in the performance of a high-efficiency X-Ku band 1-W HBT power MMIC operating under ~2 dB compression for an extended period. The main finding of this study is that no new degradation mechanisms appeared, even under severe RF stress; the device degraded in the same manner as with DC stress only. The only significant change in device characteristics was increased base leakage current that resulted in a monotonic reduction in current gain after an initial period of stability, Output power of the MMIC remained essentially unchanged even after current gain had dropped to 60% of its initial value, RF properties of the device, both small and large signal, showed little change even after severe deterioration of DC characteristics. The results of this study suggest that HBT reliability can be effectively evaluated for most applications by applying only DC stress to the device
Keywords
III-V semiconductors; MMIC power amplifiers; aluminium compounds; bipolar MMIC; gallium arsenide; heterojunction bipolar transistors; integrated circuit reliability; microwave power amplifiers; power integrated circuits; 1 W; DC characteristics; GaAs-AlGaAs; HBT reliability evaluation; Ku-band; RF properties; RF stress; SHF; X-band; base leakage current; current gain; device characteristics; output power; performance degradation; power HBT MMIC; Degradation; Electronic ballasts; Gallium arsenide; Heterojunction bipolar transistors; MMICs; Power amplifiers; Radio frequency; Resistors; Stress; Voltage;
fLanguage
English
Journal_Title
Microwave and Guided Wave Letters, IEEE
Publisher
ieee
ISSN
1051-8207
Type
jour
DOI
10.1109/75.482066
Filename
482066
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