DocumentCode
1251766
Title
Parallel Heterogeneous Integration of Chip-Scale Parts by Self-Assembly
Author
Park, Kwang Soon ; Hoo, Ji Hao ; Baskaran, Rajashree ; Böhringer, Karl F.
Author_Institution
Dept. of Electr. Eng., Univ. of Washington, Seattle, WA, USA
Volume
21
Issue
6
fYear
2012
Firstpage
1273
Lastpage
1275
Abstract
This letter reports a novel methodology for the orientation-specific parallel heterogeneous integration of parts of various sizes. Assembly sites are designed to only attract specific parts from an unsorted pool using the combined effect of Faraday waves and magnetic forces, achieving one-to-one part-to-site registration. We demonstrate the assembly of two types of thin parts (2000 × 2000 × 100 and 4000 × 4000 × 100 μm3) onto the same substrate through a one-step process. Statistical analysis of the distributions of magnetic forces delimits the suitable range for the strength of Faraday waves to fix nonoptimal initial placements and orientations.
Keywords
self-assembly; statistical analysis; system-in-package; Faraday waves; assembly sites; chip scale parts; magnetic force; nonoptimal initial placement; orientation specific parallel heterogeneous integration; self assembly; statistical analysis; unsorted pool; Assembly; Magnetic forces; Magnetic liquids; Self-assembly; Substrates; Directed self-assembly; fluidic self-assembly (FSA); heterogeneous system integration; orientation specific; packaging; self-assembly;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/JMEMS.2012.2205905
Filename
6249711
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