• DocumentCode
    1251766
  • Title

    Parallel Heterogeneous Integration of Chip-Scale Parts by Self-Assembly

  • Author

    Park, Kwang Soon ; Hoo, Ji Hao ; Baskaran, Rajashree ; Böhringer, Karl F.

  • Author_Institution
    Dept. of Electr. Eng., Univ. of Washington, Seattle, WA, USA
  • Volume
    21
  • Issue
    6
  • fYear
    2012
  • Firstpage
    1273
  • Lastpage
    1275
  • Abstract
    This letter reports a novel methodology for the orientation-specific parallel heterogeneous integration of parts of various sizes. Assembly sites are designed to only attract specific parts from an unsorted pool using the combined effect of Faraday waves and magnetic forces, achieving one-to-one part-to-site registration. We demonstrate the assembly of two types of thin parts (2000 × 2000 × 100 and 4000 × 4000 × 100 μm3) onto the same substrate through a one-step process. Statistical analysis of the distributions of magnetic forces delimits the suitable range for the strength of Faraday waves to fix nonoptimal initial placements and orientations.
  • Keywords
    self-assembly; statistical analysis; system-in-package; Faraday waves; assembly sites; chip scale parts; magnetic force; nonoptimal initial placement; orientation specific parallel heterogeneous integration; self assembly; statistical analysis; unsorted pool; Assembly; Magnetic forces; Magnetic liquids; Self-assembly; Substrates; Directed self-assembly; fluidic self-assembly (FSA); heterogeneous system integration; orientation specific; packaging; self-assembly;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2012.2205905
  • Filename
    6249711