DocumentCode
1253858
Title
Integrated single and two-phase micro heat sinks under IGBT chips
Author
Gillot, Charlotte ; Meysenc, Luc ; Schaeffer, Christian ; Bricard, Alain
Author_Institution
Lab. d´´Electrotech. de Grenoble, Saint Martin d´´Heres, France
Volume
22
Issue
3
fYear
1999
fDate
9/1/1999 12:00:00 AM
Firstpage
384
Lastpage
389
Abstract
Experiments have been performed to assess the feasibility of single and two-phase micro heat exchangers applied to the cooling of insulated gate bipolar transistor (IGBT) power components. After a brief recall of the principal characteristics of such heat exchangers, prototypes that have been built and tested are described. Then, the experimental measurements are compared to the predictions of the thermal and hydraulic performance with water and the inert fluorocarbon liquid (FC72) as coolant fluids
Keywords
cooling; heat exchangers; heat sinks; insulated gate bipolar transistors; FC72 fluorocarbon liquid; IGBT chip; cooling; insulated gate bipolar transistor; microchannel heat sink; power component; single-phase heat exchanger; two-phase heat exchanger; water; Cooling; Fluid flow; Heat sinks; Heat transfer; Insulated gate bipolar transistors; Microchannel; Prototypes; Silicon; Temperature; Thermal resistance;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/6144.796540
Filename
796540
Link To Document