Silicone die bond adhesive and clean in-line cure for copper lead frame

Author

Suzuki, Kazunari ; Higashino, Tomoko ; Tsubosaki, Kunihiro ; Kabashima, Akira ; Mine, Katsutoshi ; Nakayoshi, Kazumi

Author_Institution

Hitachi Microcomput. Eng. Ltd., Tokyo, Japan

Volume

13

Issue

4

fYear

1990

fDate

12/1/1990 12:00:00 AM

Firstpage

883

Lastpage

887

Abstract

Stress analysis by the finite-element method and a die bonding experiment were performed indicating that a die bond adhesive having a very low Young´s modulus is effective in reducing thermal stress. A silicone elastomer adhesive and an in-line cure process named the clean cure process were developed. In this process, the adhesive is cured quickly on a heat column, thus volatile organic species which affect the yield and reliability of devices are reduced significantly during cure. The bonding of large silicon dice to copper lead frames was successfully performed using this technology

Keywords

VLSI; finite element analysis; microassembling; packaging; silicones; stress analysis; thermal stresses; Cu lead frame; clean cure process; die bond adhesive; die bonding experiment; finite-element method; heat column; in-line cure process; large Si die bonding; low Young´s modulus adhesive; silicone elastomer adhesive; stressfree die bonding process; thermal stress reduction; Bonding; Copper; Delamination; Electronic packaging thermal management; Plastics; Silicon; Surface resistance; Thermal expansion; Thermal resistance; Thermal stresses;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.62534

Filename

62534