Boiling incipience and nucleate boiling heat transfer of highly wetting dielectric fluids from electronic materials

Author

You, Seung Mun ; Bar-Cohen, Avram ; Simon, Terry W.

Author_Institution

Dept. of Mech. Eng., Minnesota Univ., Minneapolis, MN, USA

Volume

13

Issue

4

fYear

1990

fDate

12/1/1990 12:00:00 AM

Firstpage

1032

Lastpage

1039

Abstract

An experimental study of pool boiling was conducted, using cylindrical heater surfaces of platinum, silicon dioxide, and aluminum oxide. They were immersed in FC-72 and R-123 and saturated at 1-atm pressure. The effects of fluid and surface material on boiling incipience and on the nucleate boiling curve were investigated. A probabilistic representation is used to present the incipience wall superheat values, which scattered widely for ostensibly identical runs. The difference in incipience wall superheat values with FC-72 and R-113 is significant, but the surface material´s effect on boiling incipience is small. The surface material effect is more pronounced in the nucleate boiling regime than in the incipience process

Keywords

aluminium compounds; boiling; dielectric materials; heat sinks; organic compounds; platinum; probability; silicon compounds; Al₂O₃; FC-72; Fluorinerts; Pt; R-123; SiO₂; boiling incipience; chlorofluorocarbons; cylindrical heater surfaces; highly wetting dielectric fluids; incipience wall superheat values; nucleate boiling; nucleate boiling curve; organic compounds; pool boiling; probability; Calibration; Conducting materials; Dielectric materials; Electronics cooling; Heat transfer; Platinum; Rayleigh scattering; Silicon compounds; Surface resistance; Temperature;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.62545

Filename

62545