Prototype packages in aluminum nitride for high performance electronic systems

Author

Lodge, Kevin J. ; Sparrow, John A. ; Perry, Edward D. ; Logan, Elizabeth A. ; Goosey, Martin T. ; Pedder, David J. ; Montgomery, Clive

Author_Institution

Plessey Res. Caswell Ltd., Towcester, UK

Volume

13

Issue

4

fYear

1990

fDate

12/1/1990 12:00:00 AM

Firstpage

633

Lastpage

638

Abstract

The way in which many standard processing techniques such as laser cutting, thick and thin film deposition, glassing and soldering can be used with aluminum nitride is illustrated, and some of the ways in which material and process compatibilities can be achieved are highlighted. The viability of such techniques is demonstrated by the production of aluminum nitride prototype packages and substrates using thick-film and thin-film technologies. Substrate preparation, package walls, lid sealing, and leads are discussed

Keywords

aluminium compounds; ceramics; integrated circuit technology; packaging; substrates; AlN; AlN prototype packages; ceramics; glassing; high performance electronic systems; integrated circuits; laser cutting; lid sealing; multichip module; soldering; standard processing techniques; substrate preparation; thick film deposition; thin film deposition; Aluminum nitride; Laser beam cutting; Optical materials; Packaging; Production; Prototypes; Soldering; Sputtering; Substrates; Transistors;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.62572

Filename

62572