New method of water cleaning for circuit substrate

Author

Takayama, Nao ; Sugiyama, Tomiji ; Takahashi, Kazuhiko

Author_Institution

Shindengen Electr. Manuf. Co. Ltd., Saitama, Japan

Volume

13

Issue

4

fYear

1990

fDate

12/1/1990 12:00:00 AM

Firstpage

685

Lastpage

692

Abstract

A water-soluble flux with characteristics equivalent to those of rosin flux was developed by improving the activator and rheological modifier. The flux paste and specially developed cleaning equipment are described. Cleaning using the solder paste and the developed cleaning equipment was used on on-board power supply products. These products passed 1500 h of temperature, humidity, and bias testing, showing that this method combining the water-soluble paste and the cleaning equipment can provide the same reliability as processing by the conventional cleaning method using rosin flux and solvent

Keywords

circuit reliability; hybrid integrated circuits; printed circuit manufacture; soldering; substrates; surface treatment; 1500 h; PC boards; activator; assembly process; bias testing; circuit substrate; cleaning equipment; flux paste; humidity testing; hybrid integrated circuits; on-board power supply products; reliability; rheological modifier; rosin flux; solder paste; temperature testing; water cleaning method; water-soluble flux; Assembly; Chemicals; Circuits; Cleaning; Manufacturing; Printing; Reflow soldering; Resins; Solvents; Water pollution;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.62580

Filename

62580