DocumentCode
1263161
Title
Effective elastic modulus of underfill material for flip-chip applications
Author
Qu, Jianmin ; Wong, C.P.
Author_Institution
George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume
25
Issue
1
fYear
2002
fDate
3/1/2002 12:00:00 AM
Firstpage
53
Lastpage
55
Abstract
In this paper, a micromechanics model based on the Mori-Tanaka method was developed to estimate the elastic modulus of underfill materials. An explicit expression of the underfill modulus was derived as a function of filler content and the properties of the matrix and the fillers. Predictions of the modulus from this theory were compared with experimentally measured values. Excellent agreement was observed
Keywords
elastic moduli; filled polymers; flip-chip devices; micromechanics; Mori-Tanaka method; elastic modulus; filled polymer; flip-chip package; micromechanical model; underfill material; Capacitive sensors; Ceramics; Composite materials; Encapsulation; Fatigue; Packaging; Semiconductor device measurement; Silicon; Soldering; Thermal expansion;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/6144.991175
Filename
991175
Link To Document