• DocumentCode
    1266738
  • Title

    The design, characterization, and modeling of RF LDMOSFETs on silicon-on-insulator material

  • Author

    McShane, E. ; Shenai, Krishna

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA
  • Volume
    49
  • Issue
    4
  • fYear
    2002
  • fDate
    4/1/2002 12:00:00 AM
  • Firstpage
    643
  • Lastpage
    651
  • Abstract
    This paper presents the first results of a practical 30 V RF LDMOSFET in silicon-on-insulator (SOI) material. Its complete electrical characteristics, DC and radio frequency (RF), are presented. Bulk silicon LDMOSFETs are popular in RF power applications, and SOI promises to improve device characteristics, enhance integration and provide high-temperature robustness. This work demonstrates that SOI LDMOSFETs can deliver performance comparable to bulk Si using an SOI CMOS foundry with only minimal process enhancements. To investigate the impact of feature sizing in the LDD and gate length on the static and RF performance, 12 devices were fabricated. Characterization was done at the wafer level and devices were packaged and used to construct a class A RF amplifier. The devices exhibited a subthreshold slope of 214 mV/decade, a transconductance of 30 mS, and fT up to 10.9 GHz. The amplifier had a maximum power output of 115 mW, gain of 14 dB, and a drain efficiency of 27% at Pout, max
  • Keywords
    UHF field effect transistors; power MOSFET; semiconductor device breakdown; semiconductor device models; silicon-on-insulator; 1 GHz; 10.9 GHz; 115 mW; 14 dB; 27 percent; 30 V; 30 mS; DC characteristics; LDD; RF LDMOSFETs; RF characteristics; RF power applications; SOI CMOS foundry; SOI material; class-A RF amplifier; electrical characteristics; feature sizing; gate length; high-temperature robustness; lateral double-diffused MOSFET; lightly doped drain; power MOSFETs; subthreshold slope; transconductance; CMOS process; Electric variables; Foundries; Packaging; Radio frequency; Radiofrequency amplifiers; Robustness; Silicon on insulator technology; Transconductance; Wafer scale integration;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.992874
  • Filename
    992874