Generalized image method with application to the thermal modeling of power devices and circuits

Author

Rinaldi, Niccolò

Author_Institution

Dept. of Electron. & Telecommun. Eng., Univ. of Naples "Federico II", Italy

Volume

49

Issue

4

fYear

2002

fDate

4/1/2002 12:00:00 AM

Firstpage

679

Lastpage

686

Abstract

A new analytical thermal model of multilayer substrates is presented. Based on a generalization of the method of images, the model is straightforward to implement and allows a clearer understanding of the effect of geometric and material parameters on the temperature field. Approximate expressions for the thermal resistance in multilayer substrates are derived for the first time. The generalized image method can be applied to solve similar problems which involve the solution of the Laplace equation in composite domains consisting of several layers. Typical examples are problems of the electrostatics and ohmic conduction phenomena

Keywords

Laplace equations; circuit simulation; electrostatics; integrated circuit modelling; semiconductor device models; temperature distribution; thermal analysis; thermal resistance; IC modeling; Laplace equation; circuit simulator; composite domains; electrostatics; generalized image method; geometric parameters; material parameters; multilayer substrates; ohmic conduction phenomena; semiconductor device modeling; temperature field; thermal modeling; thermal resistance; Boundary conditions; Circuit simulation; Electrostatics; Integrated circuit modeling; Laplace equations; Nonhomogeneous media; Solid modeling; Substrates; Temperature distribution; Thermal resistance;

fLanguage

English

Journal_Title

Electron Devices, IEEE Transactions on

Publisher

ieee

ISSN

0018-9383

Type

jour

DOI

10.1109/16.992879

Filename

992879