• DocumentCode
    1273421
  • Title

    Study of Electrohydrodynamic Micropumping Through Conduction Phenomenon

  • Author

    Mahmoudi, S.R. ; Adamiak, K. ; Castle, G.S.P. ; Ashjaee, M.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of West ern Ontario, London, ON, Canada
  • Volume
    47
  • Issue
    5
  • fYear
    2011
  • Firstpage
    2224
  • Lastpage
    2234
  • Abstract
    In the present paper, a single-stage axisymmetric conduction micropump in the vertical configuration has been proposed. This micropump consists of four components: high voltage ring electrode, grounded disk-shaped electrode, insulator spacer, and inlet/outlet ports. The high-voltage electrode and grounded electrode of the device were patterned on the two separate commercial LCP substrates with 30 μm copper cladding using standard lithographic techniques. The final spacing between two electrodes and the overall size of the device were measured to be 286 μm and 50 mm × 70 mm × 5 mm, respectively. The static pressure generation of the micropump was measured at different applied voltage using three different dielectric liquids, 10-GBN Nynas and Shell Diala AX transformer oils, and N-hexane. The range of applied voltages was between 300 and 1500 VDC, and maximum pressure generation up to 100 Pa was achieved at 1500 VDC applied voltage. To further verify the experimental results, a numerical simulation was also performed. The pressure head generation was predicted numerically and compared with experimental results at different applied voltages.
  • Keywords
    dielectric liquids; discs (structures); electrohydrodynamics; flow measurement; flow simulation; lithography; micropumps; numerical analysis; pattern formation; Shell Diala AX transformer oils; VDC applied voltage; commercial LCP substrate; conduction phenomenon; copper cladding; dielectric liquid; electrohydrodynamic micropumping; grounded disk-shaped electrode; high voltage ring electrode; insulator spacer; lithographic technique; numerical simulation; pressure head generation; single stage axisymmetric conduction micropump; static pressure generation; Computers; Electrohydrodynamics; Electronic mail; Fluids; Mechanical engineering; Pumps; Dielectric liquids; electrohydrodynamics; finite element method; micropumps; space charge;
  • fLanguage
    English
  • Journal_Title
    Industry Applications, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0093-9994
  • Type

    jour

  • DOI
    10.1109/TIA.2011.2161970
  • Filename
    5954174