DocumentCode
1273521
Title
Trends in semiconductor packaging
Author
Gross, D.R.
Author_Institution
BPA(Technology & Management) Ltd., Dorking, UK
Volume
28
Issue
10
fYear
1982
fDate
10/1/1982 12:00:00 AM
Firstpage
694
Lastpage
697
Abstract
For almost 20 years the dual-inline package has been dominant in electronics assembly. The development of alternative packages for today´s complex ICs means that their days in this position may be numbered
fLanguage
English
Journal_Title
Electronics and Power
Publisher
iet
ISSN
0013-5127
Type
jour
DOI
10.1049/ep.1982.0345
Filename
5186126
Link To Document