DocumentCode
1278197
Title
Low-power high-performance double-gate fully depleted SOI circuit design
Author
Zhang, Rongtian ; Roy, Kaushik
Author_Institution
Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
Volume
49
Issue
5
fYear
2002
fDate
5/1/2002 12:00:00 AM
Firstpage
852
Lastpage
862
Abstract
Double-gate fully depleted (DGFD) SOI circuits are regarded as the next generation VLSI circuits. This paper investigates the impact of scaling on the demand and challenges of DGFD SOI circuit design for low power and high performance. We study how the added back-gate capacitance affects circuit power and performance; how to tradeoff the enhanced short-channel effect immunity with the added back-channel leakage; and how the coupling between the front- and back-gates affects circuit reliability. Our analyses over different technology generations using the MEDICI device simulator show that DGFD SOI circuits have significant advantages in driving high output load. DGFD SOI circuits also show excellent ability in controlling leakage current. However, for low output load, no gain is obtained for DGFD SOI circuits. Also, it is necessary to optimize the back-gate oxide thickness for best leakage control. Moreover, threshold variation may cause reliability problems for thin back-gate oxide DGFD SOI circuits operated at low supply voltage
Keywords
CMOS integrated circuits; MOSFET; capacitance; circuit simulation; integrated circuit design; integrated circuit modelling; integrated circuit reliability; leakage currents; low-power electronics; semiconductor device models; silicon-on-insulator; CMOS; MEDICI device simulator; added back-channel leakage; added back-gate capacitance; back-gate oxide thickness; circuit power; circuit reliability; circuit simulations; enhanced short-channel effect immunity; high output load; leakage current control; low supply voltage; low-power high-performance double-gate fully depleted SOI circuit design; next generation VLSI circuits; scaling; threshold variation; Analytical models; Capacitance; Circuit simulation; Circuit synthesis; Coupling circuits; Immune system; Leakage current; Medical simulation; Thickness control; Very large scale integration;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.998595
Filename
998595
Link To Document