• DocumentCode
    1278554
  • Title

    Experimental investigation of vibration of the shadow mask with different assembly conditions

  • Author

    Wang, Wei-Chung ; Lai, Kai-Hang

  • Author_Institution
    Dept. of Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
  • Volume
    45
  • Issue
    4
  • fYear
    1999
  • fDate
    11/1/1999 12:00:00 AM
  • Firstpage
    1046
  • Lastpage
    1056
  • Abstract
    In this paper, for different assembly conditions, the natural frequencies, mode shapes and amplitude fluctuation electronic speckle pattern interferometry (AF-ESPI) fringe patterns of the shadow mask were obtained and used to visualize the difference among the assembly conditions. Specimens of three groups including one original design, adding welds along the rims of the shadow mask in the direction of the horizontal axis and changing the thickness of the plate spring were investigated. From the AF-ESPI results, except the mode 3, the natural frequencies are increased by adding welding points along the rims in the direction of the horizontal axis. For the case of increasing the thickness of the plate spring, the natural frequencies of all modes are increased. Generally speaking, adding welds improve the vibration behavior for the third, fourth and fifth modes. The first and second modes, however, are predominated by the shadow mask. In addition, the vibration characteristics of the sixth mode is not improved by changing the assembly conditions.
  • Keywords
    CCD image sensors; assembling; display instrumentation; dynamic testing; electronic speckle pattern interferometry; welding; CCD camera; CRT; amplitude fluctuation; assembly conditions; electronic speckle pattern interferometry; experimental investigation; fringe patterns; modal testing method; mode shapes; natural frequencies; plate spring thickness; shadow mask vibration; welds; Assembly; Etching; Interferometry; Large Hadron Collider; Mechanical engineering; Shape; Springs; Testing; Vibrations; Welding;
  • fLanguage
    English
  • Journal_Title
    Consumer Electronics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0098-3063
  • Type

    jour

  • DOI
    10.1109/30.809181
  • Filename
    809181