• DocumentCode
    1279405
  • Title

    An early detection method of device burn-in failure caused by tungsten side-diffusion through seam in premetal dielectric film

  • Author

    Lee, Sang-Yun ; Choi, Jeong ; Chen, Sean ; Liu, Wen-Shu ; McAllister, Ken

  • Author_Institution
    Res. & Dev. Center, Integrated Device Technol. Inc., Hillsboro, OR, USA
  • Volume
    23
  • Issue
    5
  • fYear
    2002
  • fDate
    5/1/2002 12:00:00 AM
  • Firstpage
    252
  • Lastpage
    254
  • Abstract
    A simple early detection method of defective devices before burn-in test has been discussed when the defect comes from tungsten side-diffusion through seams in premetal dielectric film. Tunneling current through thin remaining premetal dielectric film along seams caused by the tungsten side-diffusion has been measured and analyzed. Using the proposed early detection method, it becomes easy to compare seam formation in different premetal dielectric films and process parameters which affect seam formation.
  • Keywords
    dielectric thin films; diffusion; failure analysis; semiconductor device reliability; semiconductor device testing; tunnelling; detection method; device burn-in failure; premetal dielectric film; process parameters; seam; side-diffusion; tunneling current; Current measurement; Dielectric films; Failure analysis; Inspection; Leakage current; Scanning electron microscopy; Semiconductor films; Testing; Tungsten; Tunneling;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.998867
  • Filename
    998867