DocumentCode
1279405
Title
An early detection method of device burn-in failure caused by tungsten side-diffusion through seam in premetal dielectric film
Author
Lee, Sang-Yun ; Choi, Jeong ; Chen, Sean ; Liu, Wen-Shu ; McAllister, Ken
Author_Institution
Res. & Dev. Center, Integrated Device Technol. Inc., Hillsboro, OR, USA
Volume
23
Issue
5
fYear
2002
fDate
5/1/2002 12:00:00 AM
Firstpage
252
Lastpage
254
Abstract
A simple early detection method of defective devices before burn-in test has been discussed when the defect comes from tungsten side-diffusion through seams in premetal dielectric film. Tunneling current through thin remaining premetal dielectric film along seams caused by the tungsten side-diffusion has been measured and analyzed. Using the proposed early detection method, it becomes easy to compare seam formation in different premetal dielectric films and process parameters which affect seam formation.
Keywords
dielectric thin films; diffusion; failure analysis; semiconductor device reliability; semiconductor device testing; tunnelling; detection method; device burn-in failure; premetal dielectric film; process parameters; seam; side-diffusion; tunneling current; Current measurement; Dielectric films; Failure analysis; Inspection; Leakage current; Scanning electron microscopy; Semiconductor films; Testing; Tungsten; Tunneling;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/55.998867
Filename
998867
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