DocumentCode
127974
Title
Radiated emission from signal traces changing reference planes
Author
van Doorn, Marcel
Author_Institution
Philips Innovation Services - EMC Center, Eindhoven, Netherlands
fYear
2014
fDate
1-4 Sept. 2014
Firstpage
709
Lastpage
712
Abstract
This paper describes the radiated emission from signal traces changing reference planes in printed circuit boards. The effects of via distance, number of vias, plane distance, and stitching vias at the board edges have been investigated using 3D electromagnetic simulations. New quantitative EMC design guidelines for printed circuit boards to reduce radiated emission in the frequency range 100 MHz to 6 GHz are presented.
Keywords
electromagnetic compatibility; electromagnetic waves; printed circuit design; vias; 3D electromagnetic simulations; board edges; frequency 100 MHz to 6 GHz; plane distance; printed circuit boards; quantitative EMC design guidelines; radiated emission; signal traces changing reference planes; stitching vias; via distance; Design methodology; Electromagnetic compatibility; Electromagnetics; Europe; Integrated circuit modeling; Printed circuits; Three-dimensional displays; 3D electromagnetic modeling; EMC design guidelines; printed circuit board design; radiated emission; reference planes; via crossing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (EMC Europe), 2014 International Symposium on
Conference_Location
Gothenburg
Type
conf
DOI
10.1109/EMCEurope.2014.6930996
Filename
6930996
Link To Document