• DocumentCode
    1281468
  • Title

    Emitter size effect on current gain in fully self-aligned AlGaAs/GaAs HBT´s with AlGaAs surface passivation layer

  • Author

    Hayama, Nobuyuki ; Honjo, Kazuhiko

  • Author_Institution
    NEC Corp., Kawasaki, Japan
  • Volume
    11
  • Issue
    9
  • fYear
    1990
  • Firstpage
    388
  • Lastpage
    390
  • Abstract
    The emitter size effect for fully self-aligned AlGaAs-GaAs heterojunction bipolar transistors (HBTs) with depleted AlGaAs passivation layers, in which the partially thinned AlGaAs emitter is self-aligned by using the dual sidewall process, is investigated. It is demonstrated that drastic improvement in the emitter size effect can be achieved with an AlGaAs passivation layer as small as 0.2 mu m in width, due to the surface recombination current reduction by a factor of 1/40 in the extrinsic base region. It has also been found that the base current is dominated by excess leakage current in the proton-implanted isolation region.<>
  • Keywords
    III-V semiconductors; aluminium compounds; gallium arsenide; heterojunction bipolar transistors; passivation; semiconductor technology; 0.2 micron; AlGaAs surface passivation layer; AlGaAs-GaAs; HBTs; base current; current gain; depleted AlGaAs passivation layers; dual sidewall process; emitter size effect; excess leakage current; extrinsic base region; fully self-aligned HBTs; heterojunction bipolar transistors; partially thinned AlGaAs emitter; proton-implanted isolation region; semiconductors; surface recombination current reduction; Circuits; Dry etching; Electrodes; Fabrication; Gallium arsenide; Heterojunction bipolar transistors; Leakage current; Microwave devices; Molecular beam epitaxial growth; Passivation;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.62965
  • Filename
    62965