DocumentCode
1281468
Title
Emitter size effect on current gain in fully self-aligned AlGaAs/GaAs HBT´s with AlGaAs surface passivation layer
Author
Hayama, Nobuyuki ; Honjo, Kazuhiko
Author_Institution
NEC Corp., Kawasaki, Japan
Volume
11
Issue
9
fYear
1990
Firstpage
388
Lastpage
390
Abstract
The emitter size effect for fully self-aligned AlGaAs-GaAs heterojunction bipolar transistors (HBTs) with depleted AlGaAs passivation layers, in which the partially thinned AlGaAs emitter is self-aligned by using the dual sidewall process, is investigated. It is demonstrated that drastic improvement in the emitter size effect can be achieved with an AlGaAs passivation layer as small as 0.2 mu m in width, due to the surface recombination current reduction by a factor of 1/40 in the extrinsic base region. It has also been found that the base current is dominated by excess leakage current in the proton-implanted isolation region.<>
Keywords
III-V semiconductors; aluminium compounds; gallium arsenide; heterojunction bipolar transistors; passivation; semiconductor technology; 0.2 micron; AlGaAs surface passivation layer; AlGaAs-GaAs; HBTs; base current; current gain; depleted AlGaAs passivation layers; dual sidewall process; emitter size effect; excess leakage current; extrinsic base region; fully self-aligned HBTs; heterojunction bipolar transistors; partially thinned AlGaAs emitter; proton-implanted isolation region; semiconductors; surface recombination current reduction; Circuits; Dry etching; Electrodes; Fabrication; Gallium arsenide; Heterojunction bipolar transistors; Leakage current; Microwave devices; Molecular beam epitaxial growth; Passivation;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/55.62965
Filename
62965
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