• DocumentCode
    1285555
  • Title

    Transient thermal management of temperature fluctuations during time varying workloads on portable electronics

  • Author

    Vesligaj, Mark J. ; Amon, Cristina H.

  • Author_Institution
    Dept. of Mech. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
  • Volume
    22
  • Issue
    4
  • fYear
    1999
  • fDate
    12/1/1999 12:00:00 AM
  • Firstpage
    541
  • Lastpage
    550
  • Abstract
    This paper describes the investigation of solid to liquid phase change materials (PCM´s) for passive energy storage during the condition of time varying workloads on portable electronics. The model investigated includes a thermal control unit (TCU) embedded in an epoxy polymer. A TCU is an enclosure that contains phase change material (PCM) and a thermal conductivity enhancer, is located near the power source, and acts as an energy storage and heat-spreading module. Physical experiments were carried out to investigate the performance improvements of introducing a TCU into an embedded system and were used to validate the accuracy of the numerical model. Numerical simulations were performed to study the effect duty cycles and substrate thermal conductivities have on the thermal performance of the electronic wearable computer system with passive energy storage. Additionally, the TCU was numerically modeled to determine the influence of boundary conditions on TCU performance. To quantify the improvements of the system, metrics were developed from analyzing the thermal evolution of the TCU parameters, such as temperature fields, temperature bands, PCM characteristics, and power loads. Results indicate that using a TCU for passive energy storage significantly increases the portable electronics system´s operational performance. Duty cycles with the same average power over the duration of the cycle do not influence the length of the PCM phase change time, but do impact the mean value of the temperature fluctuation bands
  • Keywords
    modules; portable computers; thermal conductivity; thermal management (packaging); transients; boundary conditions; duty cycles; electronic wearable computer system; embedded system; enclosure; epoxy polymer; heat-spreading module; portable electronics; power loads; solid to liquid phase change materials; temperature bands; temperature fields; temperature fluctuation bands; temperature fluctuations; thermal conductivity enhancer; thermal control unit; time varying workloads; transient thermal management; Energy storage; Fluctuations; Numerical models; Phase change materials; Polymers; Solids; Temperature; Thermal conductivity; Thermal management; Thermal management of electronics;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/6144.814970
  • Filename
    814970