• DocumentCode
    1285630
  • Title

    Permittivity characteristics of epoxy/alumina nanocomposite with high particle dispersibility by combining ultrasonic wave and centrifugal force

  • Author

    Kurimoto, Muneaki ; Okubo, Hitoshi ; Kato, Katsumi ; Hanai, Masahiro ; Hoshina, Yoshikazu ; Takei, Masafumi ; Hayakawa, Naoki

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Nagoya Univ., Nagoya, Japan
  • Volume
    17
  • Issue
    4
  • fYear
    2010
  • fDate
    8/1/2010 12:00:00 AM
  • Firstpage
    1268
  • Lastpage
    1275
  • Abstract
    This paper proposes a novel technique to fabricate epoxy/alumina nanocomposites with nanoparticle composite process by combination of ultrasonic wave and centrifugal force. The particle dispersion effect of the nanoparticle composite process and its influence on dielectric permittivity were discussed quantitatively. Experimental results clarified that the combination of ultrasonic wave and centrifugal force was effective to increase dispersed nanoparticles and as well as to separate residual agglomerates. We verified that the improvement of particle dispersibility in the nanoparticle composite process by combination of ultrasonic wave and centrifugal force could bring about lower permittivity of the nanocomposites, especially than that of unfilled epoxy material.
  • Keywords
    alumina; disperse systems; nanocomposites; nanofabrication; nanoparticles; permittivity; resins; ultrasonic waves; Al2O3; centrifugal force; dielectric permittivity; epoxy-alumina nanocomposite; high particle dispersibility; nanoparticle composite; particle dispersion; residual agglomerate separation; ultrasonic wave; Acoustics; Composite materials; Conducting materials; Dielectric losses; Dielectric materials; Dielectrics; Dispersion; Force; Inorganic materials; Materials; Nanoparticles; Permittivity; Polymers; Surface treatment;
  • fLanguage
    English
  • Journal_Title
    Dielectrics and Electrical Insulation, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9878
  • Type

    jour

  • DOI
    10.1109/TDEI.2010.5539699
  • Filename
    5539699