• DocumentCode
    1285753
  • Title

    Dense Matrix Inversion of Linear Complexity for Integral-Equation-Based Large-Scale 3-D Capacitance Extraction

  • Author

    Chai, Wenwen ; Jiao, Dan

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
  • Volume
    59
  • Issue
    10
  • fYear
    2011
  • Firstpage
    2404
  • Lastpage
    2421
  • Abstract
    State-of-the-art integral-equation-based solvers rely on techniques that can perform a dense matrix-vector multiplication in linear complexity. We introduce the H2 matrix as a mathematical framework to enable a highly efficient computation of dense matrices. Under this mathematical framework, as yet, no linear complexity has been established for matrix inversion. In this work, we developed a matrix inverse of linear complexity to directly solve the dense system of linear equations for the 3-D capacitance extraction involving arbitrary geometry and nonuniform materials. We theoretically proved the existence of the H2 matrix representation of the inverse of the dense system matrix, and revealed the relationship between the block cluster tree of the original matrix and that of its inverse. We analyzed the complexity and the accuracy of the proposed inverse, and proved its linear complexity, as well as controlled accuracy. The proposed inverse-based direct solver has demonstrated clear advantages over state-of-the-art capacitance solvers such as FastCap and HiCap: with fast CPU time and modest memory consumption, and without sacrificing accuracy. It successfully inverts a dense matrix that involves more than one million unknowns associated with a large-scale on-chip 3-D interconnect embedded in inhomogeneous materials with fast CPU time and less than 5-GB memory.
  • Keywords
    integral equations; integrated circuit interconnections; matrix inversion; microprocessor chips; CPU time; FastCap; HiCap; arbitrary geometry; capacitance solvers; cluster tree; dense matrix inversion; inhomogeneous materials; integral equation; large-scale 3D capacitance extraction; large-scale on-chip 3D interconnect; linear complexity; linear equations; mathematical framework; matrix representation; memory consumption; nonuniform materials; vector multiplication; Accuracy; Capacitance; Complexity theory; Conductors; Electric potential; Materials; Sparse matrices; ${cal H}^{2}$ matrix; Capacitance extraction; direct solver; integral-equation-based methods; matrix inversion;
  • fLanguage
    English
  • Journal_Title
    Microwave Theory and Techniques, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9480
  • Type

    jour

  • DOI
    10.1109/TMTT.2011.2160964
  • Filename
    5966372