Encapsulating resins for semiconductors

Author

Iko, Kazuo ; Nakamura, Yoshinobu ; Yamaguchi, Miho ; Imamura, Nobuyuki

Volume

6

Issue

4

fYear

1990

Firstpage

25

Lastpage

32

Abstract

Technological trends in IC packaging in Japan are briefly reviewed. Epoxy resins have been successfully applied as encapsulating resins for ICs and LSIs (large-scale integrated circuits). An epoxy resin with improved moisture resistance has been effectively used in the production of VLSI devices. For the 1- to 4-Mb DRAMs that are soon going to be produced in Japan, the encapsulating resin must comply with strict requirements arising from a larger chip size, a higher device density, and up-to-date surface-mounting technology. The problems faced in this resin application, such as decreasing the heat stress, reducing the influence of solder dipping, and improving moisture resistance are described. The ways in which these problems are being solved are outlined.<>

Keywords

DRAM chips; VLSI; encapsulation; integrated circuit technology; packaging; surface mount technology; DRAMs; IC packaging; Japan; LSIs; VLSI; chip size; device density; encapsulating resins; epoxy resin; heat stress; moisture resistance; solder dipping; surface-mounting technology; Epoxy resins; Integrated circuit packaging; Integrated circuit technology; Large scale integration; Moisture; Production; Resistance heating; Surface resistance; Surface-mount technology; Very large scale integration;

fLanguage

English

Journal_Title

Electrical Insulation Magazine, IEEE

Publisher

ieee

ISSN

0883-7554

Type

jour

DOI

10.1109/57.63056

Filename

63056