Dynamical mapping and end-point detection of photoresist development by using plastic-fiber-bundle probe array

Author

Lin, Gong-Ru

Author_Institution

Inst. of Electro-Opt. Eng., Taipei, Taiwan

Volume

48

Issue

6

fYear

1999

fDate

12/1/1999 12:00:00 AM

Firstpage

1319

Lastpage

1323

Abstract

A multiport plastic-optical-fiber-bundle-based (POFB-based) metrology for dynamic monitoring of the endpoint and variation on thickness or dissolving rate of photoresist film during development is demonstrated. Experimentally, the dissolution process of the AZ1350 photoresist film at several different sites on a 150-mm (6-in) silicon wafer was dynamically monitored. The dissolving rate can be simultaneously estimated from the time-resolved optical interference reflected from the sample surface. The deviation on the thickness of PR film estimated by using the current apparatus is in good agreement with that observed by ellipsometry. The error in measurements is less than 1%, Furthermore, a two-dimensional contour mapping of the thickness of PR film on silicon wafer has been demonstrated by using 36 POFB probes

Keywords

dissolving; fibre optic sensors; optical arrays; photoresists; process monitoring; thickness measurement; 150 mm; 6 in; AZ1350 photoresist film; development; dissolution rate; dynamic monitoring; end-point detection; measurement error; multiport plastic-optical-fiber-bundle probe array; silicon wafer; thickness metrology; time-resolved optical interference; two-dimensional contour mapping; Ellipsometry; Interference; Metrology; Monitoring; Optical films; Plastic films; Resists; Semiconductor films; Silicon; Thickness measurement;

fLanguage

English

Journal_Title

Instrumentation and Measurement, IEEE Transactions on

Publisher

ieee

ISSN

0018-9456

Type

jour

DOI

10.1109/19.816155

Filename

816155