DocumentCode
1289443
Title
Electron-beam damage of self-aligned silicon bipolar transistors and circuits
Author
Jenkins, Keith A. ; Cressler, John D.
Author_Institution
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Volume
38
Issue
6
fYear
1991
fDate
6/1/1991 12:00:00 AM
Firstpage
1450
Lastpage
1458
Abstract
The susceptibility of modern self-aligned bipolar transistors to damage by energetic electron beams has been studied. Electrons of energies encountered in electron beam testing, electron microscopy and electron beam lithography, which are below the displacement damage threshold, have been used. The change in DC electrical properties has been measured as a function of the electron beam energy and dose. The primary effect of irradiation is a loss of current gain. The damage is shown to be located in the sidewall oxide spacer above the emitter-base junction and is attributed to interface traps generated in this region. The requirements for annealing the damage have been determined. To assess the effect of electron beam damage on circuits, ring oscillators have been irradiated, demonstrating that, in some circumstances, radiation can degrade the average gate delay
Keywords
bipolar transistors; electron beam effects; elemental semiconductors; silicon; Si; change in DC electrical properties; effect of irradiation; electron beam damage; emitter-base junction; interface traps generated; loss of current gain; ring oscillators; self-aligned bipolar transistors; sidewall oxide spacer; Annealing; Bipolar transistors; Electric variables measurement; Electron beams; Electron microscopy; Electron traps; Energy measurement; Lithography; Silicon; Testing;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.81638
Filename
81638
Link To Document