• DocumentCode
    1289443
  • Title

    Electron-beam damage of self-aligned silicon bipolar transistors and circuits

  • Author

    Jenkins, Keith A. ; Cressler, John D.

  • Author_Institution
    IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
  • Volume
    38
  • Issue
    6
  • fYear
    1991
  • fDate
    6/1/1991 12:00:00 AM
  • Firstpage
    1450
  • Lastpage
    1458
  • Abstract
    The susceptibility of modern self-aligned bipolar transistors to damage by energetic electron beams has been studied. Electrons of energies encountered in electron beam testing, electron microscopy and electron beam lithography, which are below the displacement damage threshold, have been used. The change in DC electrical properties has been measured as a function of the electron beam energy and dose. The primary effect of irradiation is a loss of current gain. The damage is shown to be located in the sidewall oxide spacer above the emitter-base junction and is attributed to interface traps generated in this region. The requirements for annealing the damage have been determined. To assess the effect of electron beam damage on circuits, ring oscillators have been irradiated, demonstrating that, in some circumstances, radiation can degrade the average gate delay
  • Keywords
    bipolar transistors; electron beam effects; elemental semiconductors; silicon; Si; change in DC electrical properties; effect of irradiation; electron beam damage; emitter-base junction; interface traps generated; loss of current gain; ring oscillators; self-aligned bipolar transistors; sidewall oxide spacer; Annealing; Bipolar transistors; Electric variables measurement; Electron beams; Electron microscopy; Electron traps; Energy measurement; Lithography; Silicon; Testing;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.81638
  • Filename
    81638