Electromagnetic Characterization of Paper-Glue Compound for System-in-Package on Paper (SiPoP) Future Developments

This work investigates the dielectric properties (permittivity and losses) of a multilayer material composed by sheets of paper stacked with commercial glue. The characterization has been carried-out by measuring the scattering parameters of a rectangular waveguide loaded with the material samples. An uncertainty analysis has also been applied to evaluate the error bars, which are related to both the mechanical tolerances of the used test fixture and to the vector network analyzer measurement errors. The experiments have been carried-out between 8 and 12 GHz, i.e., in the X-band. The material exhibits a relative permittivity of about 3, a loss tangent around 0.1 with a slight anisotropy. This characterization is the first fundamental step for the future development of a new class of systems in package circuits based on paper-glue compound materials. This class of electronic circuits has been denominated: systems in package on paper.